SIA432DJ-T1-GE3【PDF 1/9 页】MOSFET N-CH 30V 12A SC70-6

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Sheet目录514

[1页]2页 3页 4页 5页

SiA432DJ

www.vishay.com

N-Channel 30 V (D-S) MOSFET

Vishay Siliconix

PRODUCT SUMMARY

V DS (V) R DS(on) ( ? )

0.0200 at V GS = 10 V

0.0240 at V GS = 4.5 V

I D (A) b, c

10.1

9.2

Q g (TYP.)

5.6

FEATURES

? TrenchFET ? power MOSFET

? Thermally enhanced PowerPAK ? SC-70 package ?

- Small footprint area

? 100 % UIS tested

PowerPAK ? S C-70-6L S in g le

D 6

S 5

? Material categorization: ?

For definitions of compliance

www.vishay.com/doc?99912

please

see

APPLICATIONS

? Load Switch

2.0

Top View

Bottom View

Marking Code : A L

Ordering Information : ?

SiA432DJ-T1-GE3 (Lead (Pb)-free and Halogen-free) ?

SiA432DJ-T4-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)

N-Channel MOSFET

PARAMETER

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

SYMBOL

V DS

V GS

LIMIT

± 20

12 a

UNIT

Continuous Drain Current (T J = 150 °C)

T C = 70 °C

T A = 25 °C

I D

12 a

10.1 b, c

Pulsed Drain Current

Continuous Source-Drain Diode Current

Single-Pulse Avalanche Current

Single-Pulse Avalanche Energy

T A = 70 °C

T C = 25 °C

T A = 25 °C

L = 0.1 mH

I DM

I S

I AS

E AS

8.1 b, c

12 a

2.9 b, c

15.5

T C = 25 °C

19.2

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

12.3

3.5 b, c

T A = 70 °C

2.2 b, c

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) d, e

T J , T stg

-55 to 150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

TYPICAL

MAXIMUM

UNIT

Maximum Junction-to-Ambient b, f

Maximum Junction-to-Case (Drain)

t ? 5s

Steady State

R thJA

R thJC

5.3

6.5

°C/W

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

S14-0179-Rev. C, 10-Feb-14

Document Number: 68697

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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